In the fields of high-end electronics manufacturing and micro-assembly, component sizes have entered the micrometer scale. A defect in a micrometer-sized component (approximately the diameter of a human hair) can lead to the failure of an entire precision circuit board. Traditional inspection methods are ineffective in addressing such challenges. However, the thermal imaging solution based on uncooled infrared focal plane detectors and 3X microscopic lenses, with its unique advantages of non-contact operation, high precision, and visualization, has become the core technology for solving this industry pain point.

Core Technical Demonstration: Clear Presentation of the Microscopic Thermal World
Our 3X microscopic thermal imaging system can clearly visualize thermal activities in the microscopic world. As shown in the example, during the inspection of a high-density circuit board, the system successfully captured the thermal distribution of an area approximately 200 micrometers in side length. Within this area, the feature sizes of components have reached the 50-micrometer level, yet our system still delivers clear imaging, demonstrating exceptional detail resolution.

*Figure 1: Thermal imaging inspection of a local area of a high-density circuit board using an uncooled infrared detector paired with a 3X microscopic lens.*

Core Advantages
Our solution integrates three technical pillars to build a stable and reliable inspection system.

Uncooled infrared detection technology eliminates the need for complex low-temperature cooling devices. It ensures immediate readiness upon startup, stability, and reliability, perfectly meeting the stringent demands of 24/7 continuous operation in industrial settings. This significantly reduces maintenance costs and total ownership costs. The 3X microscopic lens, specifically optimized for the infrared spectrum, provides 3x optical magnification and an ultra-short working distance. It powerfully focuses the thermal imager’s "vision," enhancing the resolution per pixel to the micrometer level, serving as the critical optical guarantee for detecting details as fine as 50 micrometers. The intelligent analysis software platform incorporates advanced algorithms that not only generate high-resolution thermal images but also automatically perform hotspot tracking, temperature curve analysis, and comparison with standard templates. It automatically marks abnormal defects, achieving an intelligent leap from "seeing heat" to "understanding the problem."

Application Scenarios
Our solution has successfully empowered multiple critical aspects of high-end manufacturing.

In PCB/PCBA online quality screening, the system can locate abnormal heating points caused by microscopic short circuits or poor soldering within milliseconds during power-on testing. This enables 100% online automated inspection, replacing inefficient manual sampling and fundamentally preventing defective products from leaving the production line. For chip failure analysis and R&D debugging, the solution can accurately pinpoint micrometer-level leakage paths or hotspots within chips, analyze root causes of failures, and transform failure analysis from traditional "speculative experience" to "data-driven localization," significantly shortening the R&D debugging cycle. In semiconductor process monitoring and optimization, the system can monitor minute thermal anomalies during processes such as bonding and soldering in real time, providing quantitative data for optimizing process parameters and helping to improve product yield and consistency. For precision device reliability testing, the solution supports continuous monitoring of temperature rise trends in tiny areas of MEMS sensors, RF devices, and other components during long-term aging tests, providing early warnings of potential failure risks and offering robust data support for product reliability.

Technical Specifications

Customization Capabilities
We fully understand the unique needs of different customers and provide comprehensive customization services. In terms of lens magnification, we support customization of various microscopic lenses ranging from 2X to 10X. The working wavelength can be adapted to mid-wave (MWIR) or long-wave (LWIR) infrared detectors.